Defect engineering for ultrashallow junctions using surfaces

• Main Authors: Seebauer, E.G., Yeong, S.H., Srinivasan, M.P., Kwok, C.T.M., Vaidyanathan, R., Colombeau, B., Chan, L.
• Other Authors: CHEMICAL & BIOMOLECULAR ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/74536
• Institution: National University of Singapore

10.1149/1.2727421