Numerical simulation of the flip-chip underfilling process

Proceedings of the Electronic Technology Conference, EPTC

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Main Authors:	Tay, A.A.O., Huang, Z.M., Wu, J.H., Cui, C.Q.
Other Authors:	INSTITUTE OF MICROELECTRONICS
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/75053
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Institution:	National University of Singapore

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spelling	sg-nus-scholar.10635-750532015-02-03T00:37:21Z Numerical simulation of the flip-chip underfilling process Tay, A.A.O. Huang, Z.M. Wu, J.H. Cui, C.Q. INSTITUTE OF MICROELECTRONICS MECHANICAL & PRODUCTION ENGINEERING Proceedings of the Electronic Technology Conference, EPTC 263-269 00313 2014-06-19T09:10:22Z 2014-06-19T09:10:22Z 1997 Conference Paper Tay, A.A.O.,Huang, Z.M.,Wu, J.H.,Cui, C.Q. (1997). Numerical simulation of the flip-chip underfilling process. Proceedings of the Electronic Technology Conference, EPTC : 263-269. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/75053 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Proceedings of the Electronic Technology Conference, EPTC
author2	INSTITUTE OF MICROELECTRONICS
author_facet	INSTITUTE OF MICROELECTRONICS Tay, A.A.O. Huang, Z.M. Wu, J.H. Cui, C.Q.
format	Conference or Workshop Item
author	Tay, A.A.O. Huang, Z.M. Wu, J.H. Cui, C.Q.
spellingShingle	Tay, A.A.O. Huang, Z.M. Wu, J.H. Cui, C.Q. Numerical simulation of the flip-chip underfilling process
author_sort	Tay, A.A.O.
title	Numerical simulation of the flip-chip underfilling process
title_short	Numerical simulation of the flip-chip underfilling process
title_full	Numerical simulation of the flip-chip underfilling process
title_fullStr	Numerical simulation of the flip-chip underfilling process
title_full_unstemmed	Numerical simulation of the flip-chip underfilling process
title_sort	numerical simulation of the flip-chip underfilling process
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/75053
_version_	1681088034651504640

Numerical simulation of the flip-chip underfilling process

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