Wirebound deformation during molding of IC packages

American Society of Mechanical Engineers, EEP

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Bibliographic Details
Main Authors:	Tay, A.A.O., Yeo, K.S., Wu, J.H., Lim, T.B.
Other Authors:	INSTITUTE OF MICROELECTRONICS
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/75099
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Institution:	National University of Singapore

Description
Summary:	American Society of Mechanical Engineers, EEP

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