Wirebound deformation during molding of IC packages
American Society of Mechanical Engineers, EEP
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2014
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| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/75099 |
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sg-nus-scholar.10635-750992015-01-06T07:26:28Z Wirebound deformation during molding of IC packages Tay, A.A.O. Yeo, K.S. Wu, J.H. Lim, T.B. INSTITUTE OF MICROELECTRONICS MECHANICAL & PRODUCTION ENGINEERING American Society of Mechanical Engineers, EEP 4-1 233-241 EEAEE 2014-06-19T09:10:54Z 2014-06-19T09:10:54Z 1993 Conference Paper Tay, A.A.O.,Yeo, K.S.,Wu, J.H.,Lim, T.B. (1993). Wirebound deformation during molding of IC packages. American Society of Mechanical Engineers, EEP 4-1 : 233-241. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/75099 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
American Society of Mechanical Engineers, EEP |
| author2 |
INSTITUTE OF MICROELECTRONICS |
| author_facet |
INSTITUTE OF MICROELECTRONICS Tay, A.A.O. Yeo, K.S. Wu, J.H. Lim, T.B. |
| format |
Conference or Workshop Item |
| author |
Tay, A.A.O. Yeo, K.S. Wu, J.H. Lim, T.B. |
| spellingShingle |
Tay, A.A.O. Yeo, K.S. Wu, J.H. Lim, T.B. Wirebound deformation during molding of IC packages |
| author_sort |
Tay, A.A.O. |
| title |
Wirebound deformation during molding of IC packages |
| title_short |
Wirebound deformation during molding of IC packages |
| title_full |
Wirebound deformation during molding of IC packages |
| title_fullStr |
Wirebound deformation during molding of IC packages |
| title_full_unstemmed |
Wirebound deformation during molding of IC packages |
| title_sort |
wirebound deformation during molding of ic packages |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/75099 |
| _version_ |
1681088043001315328 |