Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials
Materials Research Society Symposium Proceedings
Saved in:
| Main Authors: | , , , , |
|---|---|
| 其他作者: | |
| 格式: | Conference or Workshop Item |
| 出版: |
2014
|
| 在線閱讀: | http://scholarbank.nus.edu.sg/handle/10635/77439 |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
| 機構: | National University of Singapore |
| id |
sg-nus-scholar.10635-77439 |
|---|---|
| record_format |
dspace |
| spelling |
sg-nus-scholar.10635-774392024-11-12T21:10:45Z Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials Liu, J. Wang, W.D. Wang, L. Chi, D.Z. Loh, K.P. CHEMISTRY Materials Research Society Symposium Proceedings 812 147-152 MRSPD 2014-06-23T05:55:03Z 2014-06-23T05:55:03Z 2004 Conference Paper Liu, J.,Wang, W.D.,Wang, L.,Chi, D.Z.,Loh, K.P. (2004). Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials. Materials Research Society Symposium Proceedings 812 : 147-152. ScholarBank@NUS Repository. 02729172 http://scholarbank.nus.edu.sg/handle/10635/77439 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| description |
Materials Research Society Symposium Proceedings |
| author2 |
CHEMISTRY |
| author_facet |
CHEMISTRY Liu, J. Wang, W.D. Wang, L. Chi, D.Z. Loh, K.P. |
| format |
Conference or Workshop Item |
| author |
Liu, J. Wang, W.D. Wang, L. Chi, D.Z. Loh, K.P. |
| spellingShingle |
Liu, J. Wang, W.D. Wang, L. Chi, D.Z. Loh, K.P. Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials |
| author_sort |
Liu, J. |
| title |
Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials |
| title_short |
Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials |
| title_full |
Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials |
| title_fullStr |
Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials |
| title_full_unstemmed |
Evaluation of PECVD deposited boron nitride as copper diffusion barrier on porous low-k materials |
| title_sort |
evaluation of pecvd deposited boron nitride as copper diffusion barrier on porous low-k materials |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/77439 |
| _version_ |
1821234077089398784 |