Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer

Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer

Journal of Electronic Materials

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Bibliographic Details
Main Authors: Koh, K.A., Chua, S.J.
Other Authors: ELECTRICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Al/Si/Cu
Electromigration
Metallization
Online Access:http://scholarbank.nus.edu.sg/handle/10635/80391
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Institution: National University of Singapore
Description
Summary:Journal of Electronic Materials

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