Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer

Journal of Electronic Materials

Saved in:

Bibliographic Details
Main Authors:	Koh, K.A., Chua, S.J.
Other Authors:	ELECTRICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Al/Si/Cu Electromigration Metallization
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/80391
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

id	sg-nus-scholar.10635-80391
record_format	dspace
spelling	sg-nus-scholar.10635-803912024-11-14T02:28:37Z Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer Koh, K.A. Chua, S.J. ELECTRICAL ENGINEERING Al/Si/Cu Electromigration Metallization Journal of Electronic Materials 26 9 1070-1075 JECMA 2014-10-07T02:57:01Z 2014-10-07T02:57:01Z 1997-09 Article Koh, K.A.,Chua, S.J. (1997-09). Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer. Journal of Electronic Materials 26 (9) : 1070-1075. ScholarBank@NUS Repository. 03615235 http://scholarbank.nus.edu.sg/handle/10635/80391 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Al/Si/Cu Electromigration Metallization
spellingShingle	Al/Si/Cu Electromigration Metallization Koh, K.A. Chua, S.J. Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer
description	Journal of Electronic Materials
author2	ELECTRICAL ENGINEERING
author_facet	ELECTRICAL ENGINEERING Koh, K.A. Chua, S.J.
format	Article
author	Koh, K.A. Chua, S.J.
author_sort	Koh, K.A.
title	Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer
title_short	Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer
title_full	Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer
title_fullStr	Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer
title_full_unstemmed	Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer
title_sort	electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/80391
_version_	1821185141294235648

Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer

Similar Items