Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer

Journal of Electronic Materials

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Main Authors: Koh, K.A., Chua, S.J.
Other Authors: ELECTRICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/80391
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-803912024-11-14T02:28:37Z Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer Koh, K.A. Chua, S.J. ELECTRICAL ENGINEERING Al/Si/Cu Electromigration Metallization Journal of Electronic Materials 26 9 1070-1075 JECMA 2014-10-07T02:57:01Z 2014-10-07T02:57:01Z 1997-09 Article Koh, K.A.,Chua, S.J. (1997-09). Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer. Journal of Electronic Materials 26 (9) : 1070-1075. ScholarBank@NUS Repository. 03615235 http://scholarbank.nus.edu.sg/handle/10635/80391 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Al/Si/Cu
Electromigration
Metallization
spellingShingle Al/Si/Cu
Electromigration
Metallization
Koh, K.A.
Chua, S.J.
Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer
description Journal of Electronic Materials
author2 ELECTRICAL ENGINEERING
author_facet ELECTRICAL ENGINEERING
Koh, K.A.
Chua, S.J.
format Article
author Koh, K.A.
Chua, S.J.
author_sort Koh, K.A.
title Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer
title_short Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer
title_full Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer
title_fullStr Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer
title_full_unstemmed Electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer
title_sort electromigration in aluminum/silicon/copper metallization due to the presence of a thin oxide layer
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/80391
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