A Novel Approach for Integration of Dual Metal Gate Process Using Ultra Thin Aluminum Nitride Buffer Layer

Digest of Technical Papers - Symposium on VLSI Technology

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Main Authors:	Park, C.S., Cho, B.J., Yan, D.A., Balasubramanian, N., Kwong, D.-L.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/83391
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Institution:	National University of Singapore

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spelling	sg-nus-scholar.10635-833912015-01-10T01:55:14Z A Novel Approach for Integration of Dual Metal Gate Process Using Ultra Thin Aluminum Nitride Buffer Layer Park, C.S. Cho, B.J. Yan, D.A. Balasubramanian, N. Kwong, D.-L. ELECTRICAL & COMPUTER ENGINEERING Digest of Technical Papers - Symposium on VLSI Technology 149-150 DTPTE 2014-10-07T04:40:42Z 2014-10-07T04:40:42Z 2003 Conference Paper Park, C.S.,Cho, B.J.,Yan, D.A.,Balasubramanian, N.,Kwong, D.-L. (2003). A Novel Approach for Integration of Dual Metal Gate Process Using Ultra Thin Aluminum Nitride Buffer Layer. Digest of Technical Papers - Symposium on VLSI Technology : 149-150. ScholarBank@NUS Repository. 07431562 http://scholarbank.nus.edu.sg/handle/10635/83391 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Digest of Technical Papers - Symposium on VLSI Technology
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING Park, C.S. Cho, B.J. Yan, D.A. Balasubramanian, N. Kwong, D.-L.
format	Conference or Workshop Item
author	Park, C.S. Cho, B.J. Yan, D.A. Balasubramanian, N. Kwong, D.-L.
spellingShingle	Park, C.S. Cho, B.J. Yan, D.A. Balasubramanian, N. Kwong, D.-L. A Novel Approach for Integration of Dual Metal Gate Process Using Ultra Thin Aluminum Nitride Buffer Layer
author_sort	Park, C.S.
title	A Novel Approach for Integration of Dual Metal Gate Process Using Ultra Thin Aluminum Nitride Buffer Layer
title_short	A Novel Approach for Integration of Dual Metal Gate Process Using Ultra Thin Aluminum Nitride Buffer Layer
title_full	A Novel Approach for Integration of Dual Metal Gate Process Using Ultra Thin Aluminum Nitride Buffer Layer
title_fullStr	A Novel Approach for Integration of Dual Metal Gate Process Using Ultra Thin Aluminum Nitride Buffer Layer
title_full_unstemmed	A Novel Approach for Integration of Dual Metal Gate Process Using Ultra Thin Aluminum Nitride Buffer Layer
title_sort	novel approach for integration of dual metal gate process using ultra thin aluminum nitride buffer layer
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/83391
_version_	1681089427275776000

A Novel Approach for Integration of Dual Metal Gate Process Using Ultra Thin Aluminum Nitride Buffer Layer

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