A Novel Approach for Integration of Dual Metal Gate Process Using Ultra Thin Aluminum Nitride Buffer Layer
Digest of Technical Papers - Symposium on VLSI Technology
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Main Authors: | Park, C.S., Cho, B.J., Yan, D.A., Balasubramanian, N., Kwong, D.-L. |
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Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/83391 |
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Institution: | National University of Singapore |
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