Is sub-10nm thick 3D-topological insulator good for the local electrical interconnects?

10.1109/IEDM.2013.6724738

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Bibliographic Details
Main Authors: Gupta, G., Jalil, M.B.A., Liang, G.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/83870
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Institution: National University of Singapore

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