Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion

Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion

Journal of the Mechanics and Physics of Solids

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書目詳細資料
Main Authors:	Zhang, Y.W., Bower, A.F., Xia, L., Shih, C.F.
其他作者:	DEAN'S OFFICE (ENGINEERING)
格式:	Article
出版:	2014
主題:	A. Diffusion A. Electromigration A. Surface B. Elastic material C. Finite elements
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/84477
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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