A new fabrication method of low stress PECVD SiNx layers for biomedical applications

A new fabrication method of low stress PECVD SiNx layers for biomedical applications

10.1016/j.tsf.2007.07.051

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Bibliographic Details
Main Authors: Wei, J., Ong, P.L., Tay, F.E.H., Iliescu, C.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Biomedical applications
High power
Low stress
PECVD
Silicon nitride
Online Access:http://scholarbank.nus.edu.sg/handle/10635/84797
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Institution: National University of Singapore
Description
Summary:10.1016/j.tsf.2007.07.051

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