A new fabrication method of low stress PECVD SiNx layers for biomedical applications

10.1016/j.tsf.2007.07.051

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Bibliographic Details
Main Authors:	Wei, J., Ong, P.L., Tay, F.E.H., Iliescu, C.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Biomedical applications High power Low stress PECVD Silicon nitride
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/84797
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-84797
record_format	dspace
spelling	sg-nus-scholar.10635-847972023-10-30T22:01:38Z A new fabrication method of low stress PECVD SiNx layers for biomedical applications Wei, J. Ong, P.L. Tay, F.E.H. Iliescu, C. MECHANICAL ENGINEERING Biomedical applications High power Low stress PECVD Silicon nitride 10.1016/j.tsf.2007.07.051 Thin Solid Films 516 16 5181-5188 THSFA 2014-10-07T09:00:25Z 2014-10-07T09:00:25Z 2008-06-30 Article Wei, J., Ong, P.L., Tay, F.E.H., Iliescu, C. (2008-06-30). A new fabrication method of low stress PECVD SiNx layers for biomedical applications. Thin Solid Films 516 (16) : 5181-5188. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2007.07.051 00406090 http://scholarbank.nus.edu.sg/handle/10635/84797 000257452200008 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Biomedical applications High power Low stress PECVD Silicon nitride
spellingShingle	Biomedical applications High power Low stress PECVD Silicon nitride Wei, J. Ong, P.L. Tay, F.E.H. Iliescu, C. A new fabrication method of low stress PECVD SiNx layers for biomedical applications
description	10.1016/j.tsf.2007.07.051
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Wei, J. Ong, P.L. Tay, F.E.H. Iliescu, C.
format	Article
author	Wei, J. Ong, P.L. Tay, F.E.H. Iliescu, C.
author_sort	Wei, J.
title	A new fabrication method of low stress PECVD SiNx layers for biomedical applications
title_short	A new fabrication method of low stress PECVD SiNx layers for biomedical applications
title_full	A new fabrication method of low stress PECVD SiNx layers for biomedical applications
title_fullStr	A new fabrication method of low stress PECVD SiNx layers for biomedical applications
title_full_unstemmed	A new fabrication method of low stress PECVD SiNx layers for biomedical applications
title_sort	new fabrication method of low stress pecvd sinx layers for biomedical applications
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/84797
_version_	1781784509210951680

A new fabrication method of low stress PECVD SiNx layers for biomedical applications

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