Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications

Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications

10.1016/j.msea.2006.01.088

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Bibliographic Details
Main Authors: Kumar, K.M., Kripesh, V., Shen, L., Zeng, K., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Growth morphology
Intermetallic compounds
Nanoindentation technique
Sn-8Zn-3Bi alloys
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85453
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Institution: National University of Singapore
id sg-nus-scholar.10635-85453
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spelling sg-nus-scholar.10635-854532023-10-25T20:16:57Z Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications Kumar, K.M. Kripesh, V. Shen, L. Zeng, K. Tay, A.A.O. MECHANICAL ENGINEERING Growth morphology Intermetallic compounds Nanoindentation technique Sn-8Zn-3Bi alloys 10.1016/j.msea.2006.01.088 Materials Science and Engineering A 423 1-2 57-63 2014-10-07T09:08:11Z 2014-10-07T09:08:11Z 2006-05-15 Article Kumar, K.M., Kripesh, V., Shen, L., Zeng, K., Tay, A.A.O. (2006-05-15). Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications. Materials Science and Engineering A 423 (1-2) : 57-63. ScholarBank@NUS Repository. https://doi.org/10.1016/j.msea.2006.01.088 09215093 http://scholarbank.nus.edu.sg/handle/10635/85453 000237817400012 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Growth morphology
Intermetallic compounds
Nanoindentation technique
Sn-8Zn-3Bi alloys
spellingShingle Growth morphology
Intermetallic compounds
Nanoindentation technique
Sn-8Zn-3Bi alloys
Kumar, K.M.
Kripesh, V.
Shen, L.
Zeng, K.
Tay, A.A.O.
Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications
description 10.1016/j.msea.2006.01.088
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Kumar, K.M.
Kripesh, V.
Shen, L.
Zeng, K.
Tay, A.A.O.
format Article
author Kumar, K.M.
Kripesh, V.
Shen, L.
Zeng, K.
Tay, A.A.O.
author_sort Kumar, K.M.
title Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications
title_short Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications
title_full Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications
title_fullStr Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications
title_full_unstemmed Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications
title_sort nanoindentation study of zn-based pb free solders used in fine pitch interconnect applications
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/85453
_version_ 1781784678279151616

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