Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications

• Main Authors: Kumar, K.M., Kripesh, V., Shen, L., Zeng, K., Tay, A.A.O.
• Other Authors: MECHANICAL ENGINEERING
• Format: Article
• Published: 2014
• Subjects: Growth morphology; Intermetallic compounds; Nanoindentation technique; Sn-8Zn-3Bi alloys
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/85453
• Institution: National University of Singapore

10.1016/j.msea.2006.01.088