Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders

Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders

10.1016/j.msea.2011.01.115

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Bibliographic Details
Main Authors: Rao, B.S.S.C., Kumar, K.M., Kripesh, V., Zeng, K.Y.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Composite solders
Hollomon parameters
SnAgCu solder
Strain rate
Temperature
Yield strength
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85741
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Institution: National University of Singapore
Description
Summary:10.1016/j.msea.2011.01.115

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