Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders

10.1016/j.msea.2011.01.115

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Bibliographic Details
Main Authors:	Rao, B.S.S.C., Kumar, K.M., Kripesh, V., Zeng, K.Y.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Composite solders Hollomon parameters SnAgCu solder Strain rate Temperature Yield strength
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/85741
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-85741
record_format	dspace
spelling	sg-nus-scholar.10635-857412023-10-29T21:25:07Z Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders Rao, B.S.S.C. Kumar, K.M. Kripesh, V. Zeng, K.Y. MECHANICAL ENGINEERING Composite solders Hollomon parameters SnAgCu solder Strain rate Temperature Yield strength 10.1016/j.msea.2011.01.115 Materials Science and Engineering A 528 12 4166-4172 2014-10-07T09:11:36Z 2014-10-07T09:11:36Z 2011-05-15 Article Rao, B.S.S.C., Kumar, K.M., Kripesh, V., Zeng, K.Y. (2011-05-15). Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders. Materials Science and Engineering A 528 (12) : 4166-4172. ScholarBank@NUS Repository. https://doi.org/10.1016/j.msea.2011.01.115 09215093 http://scholarbank.nus.edu.sg/handle/10635/85741 000289389400032 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Composite solders Hollomon parameters SnAgCu solder Strain rate Temperature Yield strength
spellingShingle	Composite solders Hollomon parameters SnAgCu solder Strain rate Temperature Yield strength Rao, B.S.S.C. Kumar, K.M. Kripesh, V. Zeng, K.Y. Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders
description	10.1016/j.msea.2011.01.115
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Rao, B.S.S.C. Kumar, K.M. Kripesh, V. Zeng, K.Y.
format	Article
author	Rao, B.S.S.C. Kumar, K.M. Kripesh, V. Zeng, K.Y.
author_sort	Rao, B.S.S.C.
title	Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders
title_short	Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders
title_full	Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders
title_fullStr	Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders
title_full_unstemmed	Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders
title_sort	tensile deformation behavior of nano-sized mo particles reinforced snagcu solders
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/85741
_version_	1781784748754993152

Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders

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