Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders
10.1016/j.msea.2011.01.115
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Main Authors: | Rao, B.S.S.C., Kumar, K.M., Kripesh, V., Zeng, K.Y. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/85741 |
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Institution: | National University of Singapore |
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