A numerical study of the effects of temperature, moisture and vapour pressure on delamination in a PQFP during solder reflow
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
Saved in:
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Conference or Workshop Item |
| Published: |
2014
|
| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/85862 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | National University of Singapore |
| id |
sg-nus-scholar.10635-85862 |
|---|---|
| record_format |
dspace |
| spelling |
sg-nus-scholar.10635-858622024-11-13T13:22:56Z A numerical study of the effects of temperature, moisture and vapour pressure on delamination in a PQFP during solder reflow Guojun, H. Tay, A.A.O. MECHANICAL ENGINEERING Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 98-104 2014-10-07T09:13:04Z 2014-10-07T09:13:04Z 2004 Conference Paper Guojun, H.,Tay, A.A.O. (2004). A numerical study of the effects of temperature, moisture and vapour pressure on delamination in a PQFP during solder reflow. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 98-104. ScholarBank@NUS Repository. 0780388216 http://scholarbank.nus.edu.sg/handle/10635/85862 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| description |
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Guojun, H. Tay, A.A.O. |
| format |
Conference or Workshop Item |
| author |
Guojun, H. Tay, A.A.O. |
| spellingShingle |
Guojun, H. Tay, A.A.O. A numerical study of the effects of temperature, moisture and vapour pressure on delamination in a PQFP during solder reflow |
| author_sort |
Guojun, H. |
| title |
A numerical study of the effects of temperature, moisture and vapour pressure on delamination in a PQFP during solder reflow |
| title_short |
A numerical study of the effects of temperature, moisture and vapour pressure on delamination in a PQFP during solder reflow |
| title_full |
A numerical study of the effects of temperature, moisture and vapour pressure on delamination in a PQFP during solder reflow |
| title_fullStr |
A numerical study of the effects of temperature, moisture and vapour pressure on delamination in a PQFP during solder reflow |
| title_full_unstemmed |
A numerical study of the effects of temperature, moisture and vapour pressure on delamination in a PQFP during solder reflow |
| title_sort |
numerical study of the effects of temperature, moisture and vapour pressure on delamination in a pqfp during solder reflow |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/85862 |
| _version_ |
1821193516312690688 |