Diffusion kinetics and mechanical behavior of lead-free microbump solder joints in 3D packaging applications

Diffusion kinetics and mechanical behavior of lead-free microbump solder joints in 3D packaging applications

10.1109/ECTC.2011.5898498

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Bibliographic Details
Main Authors: Rao, B.S.S.C., Kripesh, V., Zeng, K.Y.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85926
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Institution: National University of Singapore
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Summary:10.1109/ECTC.2011.5898498

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