Diffusion kinetics and mechanical behavior of lead-free microbump solder joints in 3D packaging applications
10.1109/ECTC.2011.5898498
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2014
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sg-nus-scholar.10635-859262015-04-02T06:13:02Z Diffusion kinetics and mechanical behavior of lead-free microbump solder joints in 3D packaging applications Rao, B.S.S.C. Kripesh, V. Zeng, K.Y. MECHANICAL ENGINEERING 10.1109/ECTC.2011.5898498 Proceedings - Electronic Components and Technology Conference 100-108 PECCA 2014-10-07T09:13:48Z 2014-10-07T09:13:48Z 2011 Conference Paper Rao, B.S.S.C.,Kripesh, V.,Zeng, K.Y. (2011). Diffusion kinetics and mechanical behavior of lead-free microbump solder joints in 3D packaging applications. Proceedings - Electronic Components and Technology Conference : 100-108. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ECTC.2011.5898498" target="_blank">https://doi.org/10.1109/ECTC.2011.5898498</a> 9781612844978 05695503 http://scholarbank.nus.edu.sg/handle/10635/85926 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
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ScholarBank@NUS |
| description |
10.1109/ECTC.2011.5898498 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Rao, B.S.S.C. Kripesh, V. Zeng, K.Y. |
| format |
Conference or Workshop Item |
| author |
Rao, B.S.S.C. Kripesh, V. Zeng, K.Y. |
| spellingShingle |
Rao, B.S.S.C. Kripesh, V. Zeng, K.Y. Diffusion kinetics and mechanical behavior of lead-free microbump solder joints in 3D packaging applications |
| author_sort |
Rao, B.S.S.C. |
| title |
Diffusion kinetics and mechanical behavior of lead-free microbump solder joints in 3D packaging applications |
| title_short |
Diffusion kinetics and mechanical behavior of lead-free microbump solder joints in 3D packaging applications |
| title_full |
Diffusion kinetics and mechanical behavior of lead-free microbump solder joints in 3D packaging applications |
| title_fullStr |
Diffusion kinetics and mechanical behavior of lead-free microbump solder joints in 3D packaging applications |
| title_full_unstemmed |
Diffusion kinetics and mechanical behavior of lead-free microbump solder joints in 3D packaging applications |
| title_sort |
diffusion kinetics and mechanical behavior of lead-free microbump solder joints in 3d packaging applications |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/85926 |
| _version_ |
1681089890005024768 |