Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires

• Main Authors: Li, X.P., Yi, J.B., Seet, H.L., Yin, J.H., Thongmee, S., Ding, J.
• 其他作者: MECHANICAL ENGINEERING
• 格式: Conference or Workshop Item
• 出版: 2014
• 主題: Electrodeposition; MI; NiFe/Cu; Sputtering
• 在線閱讀: http://scholarbank.nus.edu.sg/handle/10635/85943

10.1109/TMAG.2007.893801