Neural network modeling with confidence bounds: A case study on the solder paste deposition process

Neural network modeling with confidence bounds: A case study on the solder paste deposition process

IEEE Transactions on Electronics Packaging Manufacturing

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Bibliographic Details
Main Authors: Ho, S.L., Xie, M., Tang, L.C., Xu, K., Goh, T.N.
Other Authors: INDUSTRIAL & SYSTEMS ENGINEERING
Format: Article
Published: 2014
Subjects:
Modeling and forecasting
Neural networks
Nonlinear regression
Prediction intervals
Process control
Solder paste deposition
Online Access:http://scholarbank.nus.edu.sg/handle/10635/87099
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/87099

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