Neural network modeling with confidence bounds: A case study on the solder paste deposition process
IEEE Transactions on Electronics Packaging Manufacturing
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sg-nus-scholar.10635-870992023-09-04T22:42:15Z Neural network modeling with confidence bounds: A case study on the solder paste deposition process Ho, S.L. Xie, M. Tang, L.C. Xu, K. Goh, T.N. INDUSTRIAL & SYSTEMS ENGINEERING Modeling and forecasting Neural networks Nonlinear regression Prediction intervals Process control Solder paste deposition IEEE Transactions on Electronics Packaging Manufacturing 24 4 323-332 ITEPF 2014-10-07T10:24:14Z 2014-10-07T10:24:14Z 2001-10 Article Ho, S.L., Xie, M., Tang, L.C., Xu, K., Goh, T.N. (2001-10). Neural network modeling with confidence bounds: A case study on the solder paste deposition process. IEEE Transactions on Electronics Packaging Manufacturing 24 (4) : 323-332. ScholarBank@NUS Repository. 1521334X http://scholarbank.nus.edu.sg/handle/10635/87099 000173531700014 Scopus |
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National University of Singapore |
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NUS Library |
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Asia |
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Singapore Singapore |
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Modeling and forecasting Neural networks Nonlinear regression Prediction intervals Process control Solder paste deposition |
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Modeling and forecasting Neural networks Nonlinear regression Prediction intervals Process control Solder paste deposition Ho, S.L. Xie, M. Tang, L.C. Xu, K. Goh, T.N. Neural network modeling with confidence bounds: A case study on the solder paste deposition process |
| description |
IEEE Transactions on Electronics Packaging Manufacturing |
| author2 |
INDUSTRIAL & SYSTEMS ENGINEERING |
| author_facet |
INDUSTRIAL & SYSTEMS ENGINEERING Ho, S.L. Xie, M. Tang, L.C. Xu, K. Goh, T.N. |
| format |
Article |
| author |
Ho, S.L. Xie, M. Tang, L.C. Xu, K. Goh, T.N. |
| author_sort |
Ho, S.L. |
| title |
Neural network modeling with confidence bounds: A case study on the solder paste deposition process |
| title_short |
Neural network modeling with confidence bounds: A case study on the solder paste deposition process |
| title_full |
Neural network modeling with confidence bounds: A case study on the solder paste deposition process |
| title_fullStr |
Neural network modeling with confidence bounds: A case study on the solder paste deposition process |
| title_full_unstemmed |
Neural network modeling with confidence bounds: A case study on the solder paste deposition process |
| title_sort |
neural network modeling with confidence bounds: a case study on the solder paste deposition process |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/87099 |
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1776258696980987904 |