Neural network modeling with confidence bounds: A case study on the solder paste deposition process
IEEE Transactions on Electronics Packaging Manufacturing
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Main Authors: | Ho, S.L., Xie, M., Tang, L.C., Xu, K., Goh, T.N. |
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Other Authors: | INDUSTRIAL & SYSTEMS ENGINEERING |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/87099 |
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Institution: | National University of Singapore |
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