Plasma graft copolymerization of 4-vinylpyridine on dense and porous SiLK for electroless plating of copper and for retardation of copper diffusion
10.1149/1.1952767
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2014
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sg-nus-scholar.10635-898102023-10-30T07:38:48Z Plasma graft copolymerization of 4-vinylpyridine on dense and porous SiLK for electroless plating of copper and for retardation of copper diffusion Zhu, Y.Q. Kang, E.T. Neoh, K.G. Osipowicz, T. Chan, L. CHEMICAL & BIOMOLECULAR ENGINEERING PHYSICS 10.1149/1.1952767 Journal of the Electrochemical Society 152 9 F107-F114 JESOA 2014-10-09T06:58:01Z 2014-10-09T06:58:01Z 2005 Article Zhu, Y.Q., Kang, E.T., Neoh, K.G., Osipowicz, T., Chan, L. (2005). Plasma graft copolymerization of 4-vinylpyridine on dense and porous SiLK for electroless plating of copper and for retardation of copper diffusion. Journal of the Electrochemical Society 152 (9) : F107-F114. ScholarBank@NUS Repository. https://doi.org/10.1149/1.1952767 00134651 http://scholarbank.nus.edu.sg/handle/10635/89810 000231066300060 Scopus |
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National University of Singapore |
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Asia |
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Singapore Singapore |
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| description |
10.1149/1.1952767 |
| author2 |
CHEMICAL & BIOMOLECULAR ENGINEERING |
| author_facet |
CHEMICAL & BIOMOLECULAR ENGINEERING Zhu, Y.Q. Kang, E.T. Neoh, K.G. Osipowicz, T. Chan, L. |
| format |
Article |
| author |
Zhu, Y.Q. Kang, E.T. Neoh, K.G. Osipowicz, T. Chan, L. |
| spellingShingle |
Zhu, Y.Q. Kang, E.T. Neoh, K.G. Osipowicz, T. Chan, L. Plasma graft copolymerization of 4-vinylpyridine on dense and porous SiLK for electroless plating of copper and for retardation of copper diffusion |
| author_sort |
Zhu, Y.Q. |
| title |
Plasma graft copolymerization of 4-vinylpyridine on dense and porous SiLK for electroless plating of copper and for retardation of copper diffusion |
| title_short |
Plasma graft copolymerization of 4-vinylpyridine on dense and porous SiLK for electroless plating of copper and for retardation of copper diffusion |
| title_full |
Plasma graft copolymerization of 4-vinylpyridine on dense and porous SiLK for electroless plating of copper and for retardation of copper diffusion |
| title_fullStr |
Plasma graft copolymerization of 4-vinylpyridine on dense and porous SiLK for electroless plating of copper and for retardation of copper diffusion |
| title_full_unstemmed |
Plasma graft copolymerization of 4-vinylpyridine on dense and porous SiLK for electroless plating of copper and for retardation of copper diffusion |
| title_sort |
plasma graft copolymerization of 4-vinylpyridine on dense and porous silk for electroless plating of copper and for retardation of copper diffusion |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/89810 |
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1781785412338974720 |