Plasma graft copolymerization of 4-vinylpyridine on dense and porous SiLK for electroless plating of copper and for retardation of copper diffusion
10.1149/1.1952767
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Main Authors: | Zhu, Y.Q., Kang, E.T., Neoh, K.G., Osipowicz, T., Chan, L. |
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Other Authors: | CHEMICAL & BIOMOLECULAR ENGINEERING |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/89810 |
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Institution: | National University of Singapore |
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