Plasma graft copolymerization of 4-vinylpyridine on dense and porous SiLK for electroless plating of copper and for retardation of copper diffusion

10.1149/1.1952767

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Bibliographic Details
Main Authors: Zhu, Y.Q., Kang, E.T., Neoh, K.G., Osipowicz, T., Chan, L.
Other Authors: CHEMICAL & BIOMOLECULAR ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/89810
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Institution: National University of Singapore
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