Characterization of interfacial reactions between ionized metal plasma deposited Al-0.5 wt.% Cu and Ti on SiO2

Characterization of interfacial reactions between ionized metal plasma deposited Al-0.5 wt.% Cu and Ti on SiO2

10.1016/S0921-5107(00)00481-5

Saved in:
Bibliographic Details
Main Authors: Lee, Y.K., Maung Latt, K., Li, S., Osipowicz, T., Chiam, S.Y.
Other Authors: PHYSICS
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/95961
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
Description
Summary:10.1016/S0921-5107(00)00481-5

Similar Items