Characterization of interfacial reactions between ionized metal plasma deposited Al-0.5 wt.% Cu and Ti on SiO2

10.1016/S0921-5107(00)00481-5

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Main Authors: Lee, Y.K., Maung Latt, K., Li, S., Osipowicz, T., Chiam, S.Y.
Other Authors: PHYSICS
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/95961
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-959612023-10-26T21:14:22Z Characterization of interfacial reactions between ionized metal plasma deposited Al-0.5 wt.% Cu and Ti on SiO2 Lee, Y.K. Maung Latt, K. Li, S. Osipowicz, T. Chiam, S.Y. PHYSICS 10.1016/S0921-5107(00)00481-5 Materials Science and Engineering B: Solid-State Materials for Advanced Technology 77 1 101-105 MSBTE 2014-10-16T09:17:51Z 2014-10-16T09:17:51Z 2000-08-07 Article Lee, Y.K., Maung Latt, K., Li, S., Osipowicz, T., Chiam, S.Y. (2000-08-07). Characterization of interfacial reactions between ionized metal plasma deposited Al-0.5 wt.% Cu and Ti on SiO2. Materials Science and Engineering B: Solid-State Materials for Advanced Technology 77 (1) : 101-105. ScholarBank@NUS Repository. https://doi.org/10.1016/S0921-5107(00)00481-5 09215107 http://scholarbank.nus.edu.sg/handle/10635/95961 000088607700018 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description 10.1016/S0921-5107(00)00481-5
author2 PHYSICS
author_facet PHYSICS
Lee, Y.K.
Maung Latt, K.
Li, S.
Osipowicz, T.
Chiam, S.Y.
format Article
author Lee, Y.K.
Maung Latt, K.
Li, S.
Osipowicz, T.
Chiam, S.Y.
spellingShingle Lee, Y.K.
Maung Latt, K.
Li, S.
Osipowicz, T.
Chiam, S.Y.
Characterization of interfacial reactions between ionized metal plasma deposited Al-0.5 wt.% Cu and Ti on SiO2
author_sort Lee, Y.K.
title Characterization of interfacial reactions between ionized metal plasma deposited Al-0.5 wt.% Cu and Ti on SiO2
title_short Characterization of interfacial reactions between ionized metal plasma deposited Al-0.5 wt.% Cu and Ti on SiO2
title_full Characterization of interfacial reactions between ionized metal plasma deposited Al-0.5 wt.% Cu and Ti on SiO2
title_fullStr Characterization of interfacial reactions between ionized metal plasma deposited Al-0.5 wt.% Cu and Ti on SiO2
title_full_unstemmed Characterization of interfacial reactions between ionized metal plasma deposited Al-0.5 wt.% Cu and Ti on SiO2
title_sort characterization of interfacial reactions between ionized metal plasma deposited al-0.5 wt.% cu and ti on sio2
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/95961
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