Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask
The 3-D microstructure can be formed by using Multi-film thickness mask (MFT-mask) with single exposure and single develop. The intensity of the UV light getting through the mask increases as the thickness of the chromium film decreases. However, the ultra-thin Cr film makes the deposition and etchi...
Saved in:
| Main Authors: | , , , , , |
|---|---|
| Format: | Book Series |
| Published: |
2018
|
| Online Access: | https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84874043393&origin=inward http://cmuir.cmu.ac.th/jspui/handle/6653943832/48101 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Chiang Mai University |
| id |
th-cmuir.6653943832-48101 |
|---|---|
| record_format |
dspace |
| spelling |
th-cmuir.6653943832-481012018-04-25T08:47:41Z Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask Narongchai Siwarakrangsun Nithi Atthi Supanit Porntheeraphat Jirawat Jantawong Komgrit Leksakul Amporn Poyai The 3-D microstructure can be formed by using Multi-film thickness mask (MFT-mask) with single exposure and single develop. The intensity of the UV light getting through the mask increases as the thickness of the chromium film decreases. However, the ultra-thin Cr film makes the deposition and etching process of Cr film difficult to control. By depositing the nickel film as a buffer layer on the Cr film, the Cr/Ni film stack can filter the UV light and increase the amount step of the light intensity. This can improve the performance of the MFT-mask to generate fine 3-D patterning step similar to gray-scale lithography with lower cost. © (2013) Trans Tech Publications, Switzerland. 2018-04-25T08:47:41Z 2018-04-25T08:47:41Z 2013-02-25 Book Series 10226680 2-s2.0-84874043393 10.4028/www.scientific.net/AMR.658.93 https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84874043393&origin=inward http://cmuir.cmu.ac.th/jspui/handle/6653943832/48101 |
| institution |
Chiang Mai University |
| building |
Chiang Mai University Library |
| country |
Thailand |
| collection |
CMU Intellectual Repository |
| description |
The 3-D microstructure can be formed by using Multi-film thickness mask (MFT-mask) with single exposure and single develop. The intensity of the UV light getting through the mask increases as the thickness of the chromium film decreases. However, the ultra-thin Cr film makes the deposition and etching process of Cr film difficult to control. By depositing the nickel film as a buffer layer on the Cr film, the Cr/Ni film stack can filter the UV light and increase the amount step of the light intensity. This can improve the performance of the MFT-mask to generate fine 3-D patterning step similar to gray-scale lithography with lower cost. © (2013) Trans Tech Publications, Switzerland. |
| format |
Book Series |
| author |
Narongchai Siwarakrangsun Nithi Atthi Supanit Porntheeraphat Jirawat Jantawong Komgrit Leksakul Amporn Poyai |
| spellingShingle |
Narongchai Siwarakrangsun Nithi Atthi Supanit Porntheeraphat Jirawat Jantawong Komgrit Leksakul Amporn Poyai Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask |
| author_facet |
Narongchai Siwarakrangsun Nithi Atthi Supanit Porntheeraphat Jirawat Jantawong Komgrit Leksakul Amporn Poyai |
| author_sort |
Narongchai Siwarakrangsun |
| title |
Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask |
| title_short |
Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask |
| title_full |
Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask |
| title_fullStr |
Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask |
| title_full_unstemmed |
Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask |
| title_sort |
fabrication of multi-level photoresist patterns in one-step lithography by using cr/ni multi-film thickness mask |
| publishDate |
2018 |
| url |
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84874043393&origin=inward http://cmuir.cmu.ac.th/jspui/handle/6653943832/48101 |
| _version_ |
1681423187139624960 |