Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask
The 3-D microstructure can be formed by using Multi-film thickness mask (MFT-mask) with single exposure and single develop. The intensity of the UV light getting through the mask increases as the thickness of the chromium film decreases. However, the ultra-thin Cr film makes the deposition and etchi...
محفوظ في:
| المؤلفون الرئيسيون: | , , , , , |
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| التنسيق: | Book Series |
| منشور في: |
2018
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| الموضوعات: | |
| الوصول للمادة أونلاين: | https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84874043393&origin=inward http://cmuir.cmu.ac.th/jspui/handle/6653943832/52570 |
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| الملخص: | The 3-D microstructure can be formed by using Multi-film thickness mask (MFT-mask) with single exposure and single develop. The intensity of the UV light getting through the mask increases as the thickness of the chromium film decreases. However, the ultra-thin Cr film makes the deposition and etching process of Cr film difficult to control. By depositing the nickel film as a buffer layer on the Cr film, the Cr/Ni film stack can filter the UV light and increase the amount step of the light intensity. This can improve the performance of the MFT-mask to generate fine 3-D patterning step similar to gray-scale lithography with lower cost. © (2013) Trans Tech Publications, Switzerland. |
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