Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask

The 3-D microstructure can be formed by using Multi-film thickness mask (MFT-mask) with single exposure and single develop. The intensity of the UV light getting through the mask increases as the thickness of the chromium film decreases. However, the ultra-thin Cr film makes the deposition and etchi...

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التفاصيل البيبلوغرافية
المؤلفون الرئيسيون: Narongchai Siwarakrangsun, Nithi Atthi, Supanit Porntheeraphat, Jirawat Jantawong, Komgrit Leksakul, Amporn Poyai
التنسيق: Book Series
منشور في: 2018
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http://cmuir.cmu.ac.th/jspui/handle/6653943832/52570
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المؤسسة: Chiang Mai University
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spelling th-cmuir.6653943832-525702018-09-04T09:27:14Z Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask Narongchai Siwarakrangsun Nithi Atthi Supanit Porntheeraphat Jirawat Jantawong Komgrit Leksakul Amporn Poyai Engineering The 3-D microstructure can be formed by using Multi-film thickness mask (MFT-mask) with single exposure and single develop. The intensity of the UV light getting through the mask increases as the thickness of the chromium film decreases. However, the ultra-thin Cr film makes the deposition and etching process of Cr film difficult to control. By depositing the nickel film as a buffer layer on the Cr film, the Cr/Ni film stack can filter the UV light and increase the amount step of the light intensity. This can improve the performance of the MFT-mask to generate fine 3-D patterning step similar to gray-scale lithography with lower cost. © (2013) Trans Tech Publications, Switzerland. 2018-09-04T09:27:14Z 2018-09-04T09:27:14Z 2013-02-25 Book Series 10226680 2-s2.0-84874043393 10.4028/www.scientific.net/AMR.658.93 https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84874043393&origin=inward http://cmuir.cmu.ac.th/jspui/handle/6653943832/52570
institution Chiang Mai University
building Chiang Mai University Library
country Thailand
collection CMU Intellectual Repository
topic Engineering
spellingShingle Engineering
Narongchai Siwarakrangsun
Nithi Atthi
Supanit Porntheeraphat
Jirawat Jantawong
Komgrit Leksakul
Amporn Poyai
Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask
description The 3-D microstructure can be formed by using Multi-film thickness mask (MFT-mask) with single exposure and single develop. The intensity of the UV light getting through the mask increases as the thickness of the chromium film decreases. However, the ultra-thin Cr film makes the deposition and etching process of Cr film difficult to control. By depositing the nickel film as a buffer layer on the Cr film, the Cr/Ni film stack can filter the UV light and increase the amount step of the light intensity. This can improve the performance of the MFT-mask to generate fine 3-D patterning step similar to gray-scale lithography with lower cost. © (2013) Trans Tech Publications, Switzerland.
format Book Series
author Narongchai Siwarakrangsun
Nithi Atthi
Supanit Porntheeraphat
Jirawat Jantawong
Komgrit Leksakul
Amporn Poyai
author_facet Narongchai Siwarakrangsun
Nithi Atthi
Supanit Porntheeraphat
Jirawat Jantawong
Komgrit Leksakul
Amporn Poyai
author_sort Narongchai Siwarakrangsun
title Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask
title_short Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask
title_full Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask
title_fullStr Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask
title_full_unstemmed Fabrication of multi-level photoresist patterns in one-step lithography by using Cr/Ni multi-film thickness mask
title_sort fabrication of multi-level photoresist patterns in one-step lithography by using cr/ni multi-film thickness mask
publishDate 2018
url https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84874043393&origin=inward
http://cmuir.cmu.ac.th/jspui/handle/6653943832/52570
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