Qualifying ultrathin alumina film prepared by plasma-enhance atomic layer deposition under low temperature operation
© 2017 Elsevier B.V. Preparation of ultrathin alumina (Al2O3) films through Plasma-Enhanced Atomic Layer Deposition (PE-ALD) at low substrate temperature is discussed. The present work aims to investigate the physical mechanism of the PE-ALD deposition process and also the characteristics of the ult...
Saved in:
Main Authors: | D. Bootkul, P. Jitsopakul, S. Intarasiri, D. Boonyawan |
---|---|
Format: | Journal |
Published: |
2018
|
Subjects: | |
Online Access: | https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85029359113&origin=inward http://cmuir.cmu.ac.th/jspui/handle/6653943832/57469 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Chiang Mai University |
Similar Items
-
Qualifying ultrathin alumina film prepared by plasma-enhance atomic layer deposition under low temperature operation
by: Bootkul D., et al.
Published: (2017) -
Qualifying ultrathin alumina film prepared by plasma-enhance atomic layer deposition under low temperature operation
by: D. Bootkul, et al.
Published: (2018) -
Microwave remote plasma enhanced-atomic layer deposition system with multicusp confinement chamber
by: A. Dechana, et al.
Published: (2018) -
Microwave remote plasma enhanced-atomic layer deposition system with multicusp confinement chamber
by: A. Dechana, et al.
Published: (2018) -
Layer-by-layer deposition of polyelectrolyte ultrathin films
by: Waenkaew P., et al.
Published: (2017)