Study of the interfaces between electroless nickel under bump metallization and lead-free solders

由 He, Min.
出版 2008

Chemokines as therapeutic targets in systematic inflammatory response syndrome

由 HE MIN
出版 2010

Morphology and kinetic study of the interfacial reaction between the Sn-3.5Ag solder and electroless Ni-P metallization

由 Chen, Zhong, He, Min, Qi, Guojun
出版 2013

Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization

由 He, Min, Chen, Zhong, Qi, Guojun
出版 2012

Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder joints

由 He, Min, Chen, Zhong, Qi, Guojun
出版 2012

Barrier properties of thin Au/Ni–P under bump metallization for Sn–3.5Ag solder

由 Kumar, Aditya, He, Min, Chen, Zhong
出版 2013

Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder

由 Kumar, A., Teo, P. S., He, Min, Chen, Zhong
出版 2012

Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films

由 Chen, Zhong, He, Min, Balakrisnan, Bavani, Chum, Chan Choy
出版 2012

Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reaction

由 He, Min, Lau, Wee Hua, Qi, Guojun, Chen, Zhong
出版 2012

Interfacial reaction between Sn-rich solders and Ni-based metallization

由 Kumar, A., Yeo, P. T., He, Min, Qi, Guojun, Chen, Zhong
出版 2012

Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization

由 He, Min, Chen, Zhong, Qi, Guojun, Wong, Chee C., Mhaisalkar, Subodh Gautam
出版 2012

Investigating the effects of solid surfaces on ice nucleation

由 Li, Kaiyong, Xu, Shun, Shi, Wenxiong, He, Min, Li, Huiling, Li, Shuzhou, Zhou, Xin, Wang, Jianjun, Song, Yanlin
出版 2013