Electrical stability of PLEDs

by Kar Y.B., Bradley D.
Published 2023

Study on reliability test of die attach material

by Yik L.C., Kar Y.B., Shafika N.
Published 2023

Solder ball robustness study on polymer core solder balls for BGA packages

by Kar Y.B., Hui T.C., Agileswari, Lo C.
Published 2023

Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests

by Kar Y.B., Hui T.C., Agileswari R., Lo C.
Published 2023

Comparison study on shear strength and intermetallic compound for SAC and polymer core solder balls

by Kar Y.B., Agileswari, Hui T.C., Talik N.A.
Published 2023

Charge transport of novel blue dibenzothiophene phenylenediamine copolymer

by Kar Y.B., Abdullah S.F., Chou Y.T., Kok H.C.
Published 2023

The effects of zinc oxide on the sinterability of hydroxyapatite

by Ching T.Y., Singh R., Yong T.C., Kar Y.B.
Published 2023

Ultraviolet Laser Diode Ablation Process for CMOS 45 nm Copper Low-K Semiconductor Wafer

by Shi K.W., Kar Y.B., Talik N.A., Yew L.W.
Published 2023

Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

by Kar Y.B., Talik N.A., Sauli Z., Fei J.S., Retnasamy V.
Published 2023

A short review of material combination in Bilayer Electrolyte of IT-SOFC

by Mat Z.A., Kar Y.B., Yong T.C., Hassan S.H.A.
Published 2023

Review on recent Developments on Fabrication Techniques of Distributed Feedback (DFB) Based Organic Lasers

by Talik N.A., Kar Y.B., Tukijan S.N.M., Wong C.L.
Published 2023

Multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer

by Shi K.W., Yow K.Y., Lo C., Kar Y.B., Misran H.
Published 2023

Rapid densification of forsterite ceramic via microwave sintering

by Meng T.Y., Yong T.C., Singh R., Ching T.Y., Kar Y.B.
Published 2023

Metallurgical bond integrity of C45 ultra fine pitch with 18m copper wire

by Kid W.B., Leng E.P., Seong L.B., Weily C., Kar Y.B.
Published 2023

Improvement of Cu-Al bond integrity on low k pad structures

by Kid W.B., Leng E.P., Yong C.C., Yi O.X., Kar Y.B.
Published 2023

Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

by Kar Y.B., Talik N.A., Sauli Z., Seng F.C., Yong T.C., Retnasamy V.
Published 2023

Proton exchange membrane (PEM) and solid oxide (SOFC) fuel cell based vehicles-a review

by Mat Z.B.A., Madya, Kar Y.B., Hassan S.H.B.A., Talik N.A.B.
Published 2023

A comparative study of CdS thin films grown on ultra-thin glass substrates by RF magnetron sputtering and chemical bath deposition

by Doroody C., Rahman K.S., Rosly H.N., Harif M.N., Isah M., Kar Y.B., Tiong S.K., Amin N.
Published 2023

Development of insulated Cu wire ball bonding

by Leong H.Y., Mohd F.Z., Ibrahim M.R., Kid W.B., Khan N., Kar Y.B., Tan L.C.
Published 2023

Fabrication and characterization of YSZ/ScSZ bilayer electrolyte via Cold- Isostatic Pressing (CIP) method for intermediate temperature-solid oxide fuel cell (IT-SOFC) application

by Mat, Z.A., Nadaraja, S.K., Zakaria, Z., Hassan, S.H.A., Kar, Y.B., Tan, C.Y., Somalu, M.R.
Published 2020