Fabrication and testing of polydimethylsiloxane (PDMS) microchannel for lab-on-chip (LOC) magnetically-labelled biological cells separation

by Abidin, U., Yunas, J., Majlis, B. Y.
Published 2016

Joule heating effect reduction of an electromagnet system utilizing on-chip magnetic core

by Abidin, U., Yunas, J., Majlis, B. Y.
Published 2016

Efficient magnetic microbeads trapping using lab-on-chip magnetic separator

by Abidin, U., Majlis, B. Y., Yunas, J.
Published 2019

Comparison of mesa and device diameter variation in double wafer-fused multi quantum-well, long-wavelength, vertical cavity surface emitting lasers

by Menon .P.S, Kandiah .K, Majlis .B.Y, Shaari .S
Published 2011

Modeling and optimizing of threshold voltage of 32nm NMOS transistor using L18 orthogonal array Taguchi method

by Elgomati, H.A., Majlis, B.Y., Ahmad, I.
Published 2017

HF etching of sacrificial spin-on glass in straight and junctioned microchannels for MEMS microstructure release

by Hamzah, A.A., Majlis, B.Y., Ahmad, I.
Published 2017

Fabrication of platinum membrane on silicon for MEMS microphone

by Hamzah, A.A., Majlis, B.Y., Ahmad, I.
Published 2017

Modelling of sacrificial spin-on glass (SOG) etching in non-straight microchannels using hydrofluoric acid

by Hamzah, A.A., Majlis, B.Y., Ahmad, I.
Published 2017

Formation of thick spin-on glass (SOG) sacrificial layer for capacitive accelerometer encapsulation

by Hamzah, A.A., Majlis, B.Y., Ahmad, I.
Published 2017

Deflection analysis of epitaxially deposited polysilicon encapsulation for MEMS devices

by Hamzah, A.A., Majlis, B.Y., Ahmad, I.
Published 2017

Modeling and optimizing of threshold voltage of 32nm NMOS transistor using L18 orthogonal array Taguchi method

by Elgomati H.A., Majlis B.Y., Ahmad I.
Published 2023

Characterization of fabrication process noises for 32nm NMOS devices

by Elgomati, H.A., Majlis, B.Y., Ahmad, I., Ziad, T.
Published 2017

Characterization of fabrication process noises for 32nm NMOS devices

by Elgomati H.A., Majlis B.Y., Ahmad I., Ziad T.
Published 2023

Sputtered encapsulation as wafer level packaging for isolatable MEMS devices: A technique demonstrated on a capacitive accelerometer

by Hamzah, A.A., Yunas, J., Majlis, B.Y., Ahmad, I.
Published 2017

Selection of high strength encapsulant for MEMS devices undergoing high-pressure packaging

by Hamzah, A.A., Husaini, Y., Majlis, B.Y., Ahmad, I.
Published 2017

Optimization of nickel thickness on substrate for TBGA using SAC387 solder material

by Ahmad, I., Majlis, B.Y., Jalar, A., Leng, E.P.
Published 2017

Influence of Optimization of Process Parameters on Threshold Voltage for Development of HfO2/TiSi2 18 nm PMOS

by Atan, N., Ahmad, I., Majlis, B.Y., Azle, M.F.
Published 2017

Influence of Optimization of Process Parameters on Threshold Voltage for Development of HfO2/TiSi2 18 nm PMOS

by Atan N., Ahmad I., Majlis B.Y., Azle M.F.
Published 2023

Analysis the effect of control factors optimization on the threshold voltage of 18 nm PMOS using L27 taguchi method

by Bte Atanb N., Majlis B.Y., Ahmad I., Chong K.H.
Published 2023

Statistical design of ultra-thin SiO2 for nanodevices

by Hashim.U, Abul Fatah M.F.A, Ahmad I, Majlis B.Y
Published 2009