Sub-mA/cm² dark current density, buffer-less Germanium (Ge) photodiodes on a 200-mm Ge-on-insulator substrate

بواسطة Lin, Yiding, Son, Bongkwon, Lee, Kwang Hong, Michel, Jurgen, Tan, Chuan Seng
منشور في 2021

PIC-integrable, uniformly 056%-tensile strained Ge-on-insulator photodiodes enabled by recessed SiNx stressor

بواسطة Lin, Yiding, Ma, Danhao, Lee, Kwang Hong, Wen, Rui-Tao, Syaranamual, Govindo, Kimerling, Lionel, Tan, Chuan Seng, Michel, Jurgen
منشور في 2021

Reduction of threading dislocation density in Ge/Si using a heavily As-doped Ge seed layer

بواسطة Lee, Kwang Hong, Bao, Shuyu, Wang, Bing, Wang, Cong, Yoon, Soon Fatt, Michel, Jurgen, Fitzgerald, Eugene A., Tan, Chuan Seng
منشور في 2016

On-chip optical interconnects using InGaN light-emitting diodes integrated with Si-CMOS

بواسطة Wang, Bing, Zhang, Li, Zhang, Wenjia, Wang, Cong, Lee, Kenneth Eng Kian, Michel, Jurgen, Chua, Soo-Jin, Peh, Li-Shiuan
منشور في 2018

Metalorganic chemical vapor deposition-regrown Ga-rich InGaP films on SiGe virtual substrates for Si-based III-V optoelectronic device applications

بواسطة Kim, TaeWan, Wang, Bing, Wang, Cong, Kohen, David A., Hwang, Jeong Woo, Shin, Jae Cheol, Kang, Sang-Woo, Michel, Jürgen
منشور في 2017

Hetero-epitaxy of high quality germanium film on silicon substrate for optoelectronic integrated circuit applications

بواسطة Lee, Kwang Hong, Bao, Shuyu, Lin, Yiding, Wang, Yue, Li, Wei, Zhang, Lin, Michel, Jurgen, Fitzgerald, Eugene A., Tan, Chuan Seng, Anantha, P.
منشور في 2019

Red InGaP light-emitting diodes epitaxially grown on engineered Ge-on-Si substrates

بواسطة Wang, Bing, Wang, Cong, Lee, Kwang Hong, Bao, Shuyu, Lee, Kenneth Eng Kian, Tan, Chuan Seng, Yoon, Soon Fatt, Fitzgerald, Eugene A., Michel, Jurgen
منشور في 2018

Performance of AlGaInP LEDs on silicon substrates through low threading dislocation density (TDD) germanium buffer layer

بواسطة Wang, Yue, Wang, Bing, Eow, Desmond Fu Shen, Michel, Jurgen, Lee, Kenneth Eng Kian, Yoon, Soon Fatt, Fitzgerald, Eugene A., Tan , Chuan Seng, Lee, Kwang Hong
منشور في 2020

The integration of InGaP LEDs with CMOS on 200 mm silicon wafers

بواسطة Wang, Bing, Lee, Kwang Hong, Wang, Cong, Wang, Yue, Made, Riko I., Sasangka, Wardhana Aji, Nguyen, Viet Cuong, Lee, Kenneth Eng Kian, Tan, Chuan Seng, Yoon, Soon Fatt, Fitzgerald, Eugene A., Michel, Jurgen
منشور في 2019