Immersion nickel deposition on blank silicon in aqueous solution containing ammonium fluoride

by Tu, K. N., Zhang, Xi, Chen, Zhong
Published 2013

The role of internal dissipation and process average temperature in chiller performance and diagnostics

by Ng, K.C., Chua, H.T., Tu, K., Gordon, J.M., Kashiwagi, T., Akisawa, A., Saha, B.B.
Published 2014

Thermodynamic analysis of absorption chillers: Internal dissipation and process average temperature

by Ng, K.C., Tu, K., Chua, H.T., Gordon, J.M., Kashiwagi, T., Akisawa, A., Saha, B.B.
Published 2014

Analytical modeling of reservoir effect on electromigration in Cu interconnects

by Zaporozhets, T., Tu, K. N., Gusak, A. M., Shao, W., Gan, Zhenghao, Chen, Zhong, Mhaisalkar, Subodh Gautam
Published 2012

Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnects

by Shao, W., Chen, Z., Tu, K. N., Gusak, A. M., Gan, Zhenghao, Mhaisalkar, Subodh Gautam, Li, Hong Yu
Published 2012

Pulse electroplating of copper film : a study of process and microstructure

by Zhang, X., Tu, K. N., Chen, Z., Tan, Y. K., Wong, Chee C., Mhaisalkar, Subodh Gautam, Li, X. M., Tung, Chih Hang, Cheng, C. K.
Published 2012