The selection of die backside metallization for solder

The selection of die backside metallization for solder

In support of the need to achieve processor speeds above 2.5 GHz, the feasibility of metallurgical heat transfer between chip and heat sink is under study. The selection of a suitable metallization on the chip backside was undertaken. Candidate stackss were evaluated based on reliability and thermal...

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書目詳細資料
Main Authors:	Tirol, D.J. Rean D., Agraharam, Sairam
格式:	text
出版:	Animo Repository 2001
主題:	Metallizing Engineering Physics Physical Sciences and Mathematics Physics
在線閱讀:	https://animorepository.dlsu.edu.ph/faculty_research/13346
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	De La Salle University

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