Evaluation of the Effects of Introducing Channels to Composite Materials to Reduce Warpage on Semiconductor Packages Due to Coefficient of Thermal Expansion Mismatch

• Main Authors: Arriola, Emmanuel, Emil Lim, Nino Rigo, Louis Moran, Roberto, Mercado, John Patrick, Dimagiba, Richard, Gonzaga, Jeremias, Ubando, Aristotle T.
• Format: text
• Published: Animo Repository 2019
• Online Access: https://animorepository.dlsu.edu.ph/faculty_research/686; https://animorepository.dlsu.edu.ph/context/faculty_research/article/1685/type/native/viewcontent
• Institution: De La Salle University

© 2019 IEEE. The warpage induced during the manufacturing process affects the yield, quality, and reliability of the semiconductor packages. Unavoidable and severe stress and deformation are observed because of incompatible of thermal expansion coefficient (CTE) of the materials such as the copper a...