Evaluation of the Effects of Introducing Channels to Composite Materials to Reduce Warpage on Semiconductor Packages Due to Coefficient of Thermal Expansion Mismatch
© 2019 IEEE. The warpage induced during the manufacturing process affects the yield, quality, and reliability of the semiconductor packages. Unavoidable and severe stress and deformation are observed because of incompatible of thermal expansion coefficient (CTE) of the materials such as the copper a...
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| Main Authors: | , , , , , , |
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| Format: | text |
| Published: |
Animo Repository
2019
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| Online Access: | https://animorepository.dlsu.edu.ph/faculty_research/686 https://animorepository.dlsu.edu.ph/context/faculty_research/article/1685/type/native/viewcontent |
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| Institution: | De La Salle University |