Transient liquid phase Ag-based solder technology for high-temperature packaging applications

Transient liquid phase Ag-based solder technology for high-temperature packaging applications

A lead-free Ag-based soldering technique through transient-liquid-phase (TLP) bonding is proposed in this study for high-temperature microelectronic packaging applications. The solder paste, which contained Ag and Sn powders with a no-clean flux, was used to join Cu substrates. The setup was bonded...

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書目詳細資料
Main Authors:	Sharif, Ahmed, Gan, Chee Lip, Chen, Zhong
其他作者:	School of Materials Science & Engineering
格式:	Article
語言:	English
出版:	2014
主題:	DRNTU::Engineering::Materials::Metallic materials::Alloys
在線閱讀:	https://hdl.handle.net/10356/102603 http://hdl.handle.net/10220/24294
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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