Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection

One primary purpose of this study is to introduce an electroless Ni–P–TiO2 (17.5 at.% of P) composite coating as a pad finish for advanced electronic packaging. In this study, TiO2 nanoparticles were incorporated into the Ni-P layer by electroless deposition and its function as novel under bump m...

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Main Authors: Yang, Ying, Chen, Zhong, Hu, Xiao, Xu, Sha, Chan, Y. C.
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2014
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Online Access:https://hdl.handle.net/10356/104454
http://hdl.handle.net/10220/20246
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-1044542023-07-14T15:56:04Z Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection Yang, Ying Chen, Zhong Hu, Xiao Xu, Sha Chan, Y. C. School of Materials Science & Engineering DRNTU::Engineering::Materials::Electronic packaging materials One primary purpose of this study is to introduce an electroless Ni–P–TiO2 (17.5 at.% of P) composite coating as a pad finish for advanced electronic packaging. In this study, TiO2 nanoparticles were incorporated into the Ni-P layer by electroless deposition and its function as novel under bump metallization (UBM) was intensively investigated. The majority of the added TiO2 nanoparticles were proved to be uniformly distributed in UBM by scanning electronic microscopy (SEM) and X-ray diffraction (XRD). The interfacial reaction between electrolessly deposited Ni-P-TiO2 layer and Sn-3.5Ag solder alloy was systematically analyzed. The prime Ni-P UBM was used for comparison to evaluate the effect of TiO2 nanoparticle on the interfacial microstructure and mechanical property. Both solder/Ni-P and solder/Ni-P-TiO2 joints were aged at temperature from 150°C to 190°C for different aging periods in order to study the intermetallic compounds (IMCs) growth and calculate the activation energy. It was found the growth of Ni3Sn4 IMC layer and void formation at the reaction interface were successfully suppressed with the help of the TiO2 nanoparticle. The activation energies for the growth of Ni3Sn4 on Ni- *Marked-up Manuscript P and Ni-P-TiO2 layer were calculated to be 50.9 kJ/mol and 55.7 kJ/mol, respectively. The extensive growth of Ni3P and Ni-Sn-P phase as well as the consumption rate of the amorphous UBM was controlled in joints with TiO2 nanoparticles. Thus Ni-P-TiO2 UBM blocked the Cu diffusion from substrate to interface. A detailed reaction induced diffusion mechanism was proposed. The solder/Ni-P-TiO2 solder joint consistently demonstrated higher shear strength than solder/Ni-P joint as a function of aging time. TiO2 nanoparticle contributed to slow down the declining rate of shear strength from 0.021 Mpa/hour to 0.013 Mpa/hour with the aging time. Moreover, after the shear strength test, fracture mainly occurred at solder matrix of the solder/Ni-P-TiO2 joint, the morphology showed a ductile fracture pattern with a large distribution of dimples on the rough surface. Accepted version 2014-07-24T04:43:36Z 2019-12-06T21:33:06Z 2014-07-24T04:43:36Z 2019-12-06T21:33:06Z 2014 2014 Journal Article Hu, X., Xu, S., Yang, Y., Chen, Z., & Chan, Y. (2014). Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection. Materials Science and Engineering: A, 600, 67-75. 0921-5093 https://hdl.handle.net/10356/104454 http://hdl.handle.net/10220/20246 10.1016/j.msea.2014.02.011 en Materials Science and Engineering: A © 2014 Elsevier B.V. This is the author created version of a work that has been peer reviewed and accepted for publication by Materials Science and Engineering: A, Elsevier B.V. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: http://dx.doi.org/10.1016/j.msea.2014.02.011 application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Materials::Electronic packaging materials
spellingShingle DRNTU::Engineering::Materials::Electronic packaging materials
Yang, Ying
Chen, Zhong
Hu, Xiao
Xu, Sha
Chan, Y. C.
Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection
description One primary purpose of this study is to introduce an electroless Ni–P–TiO2 (17.5 at.% of P) composite coating as a pad finish for advanced electronic packaging. In this study, TiO2 nanoparticles were incorporated into the Ni-P layer by electroless deposition and its function as novel under bump metallization (UBM) was intensively investigated. The majority of the added TiO2 nanoparticles were proved to be uniformly distributed in UBM by scanning electronic microscopy (SEM) and X-ray diffraction (XRD). The interfacial reaction between electrolessly deposited Ni-P-TiO2 layer and Sn-3.5Ag solder alloy was systematically analyzed. The prime Ni-P UBM was used for comparison to evaluate the effect of TiO2 nanoparticle on the interfacial microstructure and mechanical property. Both solder/Ni-P and solder/Ni-P-TiO2 joints were aged at temperature from 150°C to 190°C for different aging periods in order to study the intermetallic compounds (IMCs) growth and calculate the activation energy. It was found the growth of Ni3Sn4 IMC layer and void formation at the reaction interface were successfully suppressed with the help of the TiO2 nanoparticle. The activation energies for the growth of Ni3Sn4 on Ni- *Marked-up Manuscript P and Ni-P-TiO2 layer were calculated to be 50.9 kJ/mol and 55.7 kJ/mol, respectively. The extensive growth of Ni3P and Ni-Sn-P phase as well as the consumption rate of the amorphous UBM was controlled in joints with TiO2 nanoparticles. Thus Ni-P-TiO2 UBM blocked the Cu diffusion from substrate to interface. A detailed reaction induced diffusion mechanism was proposed. The solder/Ni-P-TiO2 solder joint consistently demonstrated higher shear strength than solder/Ni-P joint as a function of aging time. TiO2 nanoparticle contributed to slow down the declining rate of shear strength from 0.021 Mpa/hour to 0.013 Mpa/hour with the aging time. Moreover, after the shear strength test, fracture mainly occurred at solder matrix of the solder/Ni-P-TiO2 joint, the morphology showed a ductile fracture pattern with a large distribution of dimples on the rough surface.
author2 School of Materials Science & Engineering
author_facet School of Materials Science & Engineering
Yang, Ying
Chen, Zhong
Hu, Xiao
Xu, Sha
Chan, Y. C.
format Article
author Yang, Ying
Chen, Zhong
Hu, Xiao
Xu, Sha
Chan, Y. C.
author_sort Yang, Ying
title Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection
title_short Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection
title_full Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection
title_fullStr Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection
title_full_unstemmed Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection
title_sort effect of tio2 nanoparticle addition on electroless ni–p under bump metallization for lead-free solder interconnection
publishDate 2014
url https://hdl.handle.net/10356/104454
http://hdl.handle.net/10220/20246
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