Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection

• Main Authors: Yang, Ying, Chen, Zhong, Hu, Xiao, Xu, Sha, Chan, Y. C.
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2014
• Subjects: DRNTU::Engineering::Materials::Electronic packaging materials
• Online Access: https://hdl.handle.net/10356/104454; http://hdl.handle.net/10220/20246
• Institution: Nanyang Technological University

One primary purpose of this study is to introduce an electroless Ni–P–TiO2 (17.5 at.% of P) composite coating as a pad finish for advanced electronic packaging. In this study, TiO2 nanoparticles were incorporated into the Ni-P layer by electroless deposition and its function as novel under bump m...