Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection
One primary purpose of this study is to introduce an electroless Ni–P–TiO2 (17.5 at.% of P) composite coating as a pad finish for advanced electronic packaging. In this study, TiO2 nanoparticles were incorporated into the Ni-P layer by electroless deposition and its function as novel under bump m...
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Main Authors: | Yang, Ying, Chen, Zhong, Hu, Xiao, Xu, Sha, Chan, Y. C. |
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Other Authors: | School of Materials Science & Engineering |
Format: | Article |
Language: | English |
Published: |
2014
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/104454 http://hdl.handle.net/10220/20246 |
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Institution: | Nanyang Technological University |
Language: | English |
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