Dielectric failure mechanisms in advanced Cu/low-k interconnect architecture

• Main Author: Tan, Tam Lyn
• Other Authors: Hwang Nam
• Format: Theses and Dissertations
• Language: English
• Published: 2008
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• Online Access: https://hdl.handle.net/10356/14244
• Institution: Nanyang Technological University

Time-dependent dielectric breakdown (TDDB) reliability is increasingly becoming a critical reliability concern with the introduction of lower dielectric constant materials and shrinking of metal spacing in the back-end-of-line technology. Therefore, there is a need to investigate the factors causing...