Fabrication and evaluation of Ni/WSn solder joints for die-attach technology

• Main Author: Foo, Terry Zhi Yuan
• Other Authors: Chen Zhong
• Format: Final Year Project
• Language: English
• Published: Nanyang Technological University 2022
• Subjects: Engineering::Electrical and electronic engineering::Electronic packaging; Engineering::Materials::Microelectronics and semiconductor materials
• Online Access: https://hdl.handle.net/10356/157318
• Institution: Nanyang Technological University

Micro electrical mechanical systems (MEMS) are very small integrated mechanical and electrical devices which are assembled via soldering of the individual components. For MEMS that operate at high temperatures, such solder materials are conventionally high lead content alloys, which is detrimenta...