Fabrication and evaluation of Ni/WSn solder joints for die-attach technology

• المؤلف الرئيسي: Foo, Terry Zhi Yuan
• مؤلفون آخرون: Chen Zhong
• التنسيق: Final Year Project
• اللغة: English
• منشور في: Nanyang Technological University 2022
• الموضوعات: Engineering::Electrical and electronic engineering::Electronic packaging; Engineering::Materials::Microelectronics and semiconductor materials
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/157318
• المؤسسة: Nanyang Technological University

Micro electrical mechanical systems (MEMS) are very small integrated mechanical and electrical devices which are assembled via soldering of the individual components. For MEMS that operate at high temperatures, such solder materials are conventionally high lead content alloys, which is detrimenta...