Realization of three-dimensionally MEMS stacked comb structures for microactuators using low-temperature multi-wafer bonding with self-alignment techniques in CMOS-compatible processes

• Main Authors: Teo, Adrian J. T., Li, Holden King Ho
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Article
• Language: English
• Published: 2022
• Subjects: Engineering::Mechanical engineering; 3D MEMS; Wafer Bonding
• Online Access: https://hdl.handle.net/10356/160535
• Institution: Nanyang Technological University

A high-aspect-ratio three-dimensionally (3D) stacked comb structure for micromirror application is demonstrated by wafer bonding technology in CMOS-compatible processes in this work. A vertically stacked comb structure is designed to circumvent any misalignment issues that could arise from multiple...